Close-up of Semiconductor Packaging Process. Computer Chips are being Extracted by a Pick and Place Machine from Wafer and Attached to Substrate. Computer Chip Manufacturing at Factory
ID: 2259453341
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- 大图:6400 × 3600 像素·54.19 cm × 30.48 cm·300dpi·JPG
- 中图:1000 × 563 像素·35.28 cm × 19.86 cm·72dpi·JPG
- 小图:500 × 282 像素·17.64 cm × 9.95 cm·72dpi·JPG