0:00/0:12
倍速
  • x2
  • x1
  • x0.5
举报

Semiconductor Packaging Process. Close-up of Silicon Dies Attached to Substrate during Computer Chip Manufacturing and Production at Fab.

视  频 ID：  1099239717
版      权：  SweetBunFactory
视频长度：  0:12
横纵比率：  16:9
所属分类：  科技 工业 
商业用途
如何选择
授权授权书发票合同问题